Surface-mount technology

Surface-mount technology emerged in the 1960s, gained momentum in the early 1980s and became widely used by the mid 1990s. Components were mechanically redesigned to have small metal tabs or end caps that could be soldered directly on to the PCB surface. Components became much smaller and component placement on both sides of the board became more common than with through-hole mounting, allowing much higher circuit densities. Surface mounting lends itself well to a high degree of automation, reducing labour costs and greatly increasing production and quality rates. Carrier Tapes provide a stable and protective environment for Surface mount devices (SMDs) which can be one-quarter to one-tenth of the size and weight, and passive components can be one-half to one-quarter of the cost of corresponding through-hole parts. However, integrated circuits are often priced the same regardless of the package type, because the chip itself is the most expensive part. As of 2006, some wire-ended components, such as small-signal switch diodes, e.g. 1N4148, are actually significantly cheaper than corresponding SMD versions.

友情连接:智造科技 网上订货系统 网上订货平台 订单管理系统 防伪 防伪标识 防伪标签 防伪防窜货 防窜货 防窜货系统 led spotlight led射灯