Equipment and Capability

Capability

Standard Materials
Copper Claded Laminate (CEM3 with CTI600, FR4 with CTI 600&Tg130 or Tg170)
Nanya (CEM3, FR4)
Shengyi (CEM3, FR4)
Kingboard (FR4 Tg130)
Matsushita (CEM3)
Sumitomo (CEM3)
Alisbamar (CEM1,CTI600)
Isola (FR4)
Liquid photo-imageable Soldermask
Taiyo PSR 2000/4000
R500
Tamura DSR 2200.

 

PCBA capability
Minimum chip: 01005
Minimu BGA ball: 0.25mm
 
 

Production Capability 

Parameter Capabilities (2007) Capabilities (2008)
  Inches Metric Inches Metric
Layers(Min/Max)
Normal Board 2-14 2-14 2-16 2-16
BVH Board 4-8 4-8 4-10 4-10
Mterialst
FR-4(tg 135degree) Yes Yes Yes Yes
FR-4(tg 180degree) Yes Yes Yes Yes
Rogers RO4003 Yes Yes Yes Yes
High frequency(RF) No No Yes Yes
Low DK Yes Yes Yes Yes
Metal pcb Yes Yes Yes Yes
Innerlayer copper
Foil Weight
 
0.5-4.0oz 0.5-4.0oz 0.5-4.0oz 0.5-4.0oz
Min Line/Space 0.003"/0.003" 0.075"/0.075" 0.003"/0.003" 0.075"/0.075"
Limited Volume 0.002"/0.002" 0.05mm/0.05mm 0.002"/0.002" 0.05mm/0.05mm
Line Width Tol ±8% ±8% ±8% ±8%
Outerlayer Copper
Foil Weight 1/3-4.0oz 1/3-4.0oz 1/4-4.0oz 1/4-4.0oz
Min Line/Space 0.003"/0.003" 0.075/0.075mm 0.003"/0.003" 0.075/0.075mm
Limited Volume 0.003"/0.003" 0.075/0.075mm 0.002"/0.002" 0.05/0.05mm
Line Width Tol ±10% ±10% ±8% ±8%
Dielectric
Min Overall 0.012" 0.3mm 0.008" 0.02mm
Max Overall 0.126" 3.20mm 0.126" 3.20mm
Min Overall Tol ±7% ±7% ±7% ±7%
Min Dielectric Spacing 0.002" 0.050mm 0.002" 0.050mm
Min Dielectric Tolerance ±7% ±7% ±7% ±7%
Layer-to-Layer ±0.004" ±0.10mm ±0.003" ±0.075mm
Drilled Holes
Min Drilled Diameter 0.006" 0.15" 0.004" 0.10"
Max Drilled Diameter 0.250" 6.35mm 0.250" 6.35mm
Max Aspect Ratio 10:1 10:1 12:01 12:01
PTH Dia Tolerance ±0.003" ±0.075mm ±0.002" ±0.050"
NPTH Dia Tolerance ±0.001" ±0.025mm ±0.001" ±0.025mm
Hole-to-Hole Accuracy ±0.002" ±0.050mm ±0.002" ±0.050mm
PCB Routing
Edge-to-Edge Tolerance ±0.004" ±0.10mm ±0.003mm ±0.075mm
Edge-to-Daturn Tol. ±0.003" ±0.076mm ±0.003" ±0.075mm
Min Internal Radius 0.012" 0.30mm 0.012" 0.30mm
Max Routed Hole Dia 1.25" 31.75mm 1.25" 31.75mm
Max Routed Hole Tol. ±0.003" ±0.075mm ±0.003" ±0.075mm
Min Routed Hole Dia 0.024" 0.6mm 0.024" 0.6mm
Min Routed Hole Tol. ±0.003" ±0.075mm ±0.003" ±0.075mm
Scoring
Min Web Thickness 0.004" 0.10mm 0.004" 0.10mm
Scoring Angles 30, 45, 60 30, 45, 60 30, 45, 60 30, 45, 60
web Thickness Tol. ±0.001" ±0.0254mm ±0.001" ±0.0254mm
Solder Mask
Nominal Thickness Over Trace 0.004" 0.10mm 0.004" 0.10mm
Registration Tolerance ±0.002 ±0.005mm ±0.002 ±0.005mm
Space Required for Mask Between Pads 0.008" 0.20" 0.008" 0.20"
Legend
Type Epoxy Epoxy Epoxy Epoxy
Min Line Width 0.006" 0.15mm 0.006" 0.15mm
Min Accuracy ±0.006" ±0.15mm ±0.006" ±0.15mm
Conductor Surface Finishes
HASL 80-1000 u inch 2.0-25 Microns 80-1000 u inch 2.0-25 Microns
OSP(Entek) 8-20 u inch 0.2-0.5 Microns 8-20 u inch 0.2-0.5 Microns
Nickel-Min Thickness 100 u inch 2.54 Microns 100 u inch 2.54 Microns
Gold-Min Thickness 1-4 u inch .025-0.10 um 1-4 u inch .025-0.10 um
Immersion Tin Thickness 16-48 u inch 0.8-1.2um 16-48 u inch 0.8-1.2um
Immersion Silver Thickness 8-16u inch 0.2-0.4um 8-16u inch 0.2-0.4um
Electrical Test
Single Ended Impedance Yes Yes Yes Yes
Max Continuity Voltage 250V 250V 250V 250V
Max Isolation Resistance 100 Megohm 100 Megohm 100 Megohm 100 Megohm
Min Continuity Resistance 5 ohms 5 ohms 5 ohms 5 ohms
Warp & Twist
Warp & Twist 0.50% 0.50% 0.50% 0.50%
IMPEDANCE
Impedance 10% 10% 8% 8%
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